Electronic Precision

Value proposition:

Support the miniaturization trend of electronic equipment with nanometer-level precision to meet the needs of high precision and high reliability.

Core capabilities:

• Sheet metal processing: Using 0.1mm ultra-thin stainless steel foil stamping technology, we produce micron-level structural parts such as 5G base station heat sinks, with hole spacing accuracy controlled within ±0.01mm to ensure heat dissipation performance and electromagnetic shielding effect.

• Custom molds: Combining PVD coating and mirror polishing technology, we manufacture high-precision molds such as semiconductor equipment vacuum cavities, with leakage rates controlled below 1×10⁻⁹Pa·m³/s, to ensure stable operation and long-term reliability of the equipment in a vacuum environment.